Reliability and Failure of Electronic Materials and Devices, 2nd Edition

L

Large angle tilt implanted drain structure, 364

Large scale integration (LSI), 5

Laser damage, 587–589

energy flux, 589–590

thermal runaway, 590–592

Laser ionization mass analysis (LIMA), 644, 646

Laser scanning microscope, 628

Laser-induced damage, 586–587

Laser(s), 428, 565

See also Channeled-substrate buried heterostructure lasers

beam heating, 121

degradation, 93

degradation kinetics, 570

destruction, 582

failure/reliability, 566–583

microscopic mechanisms, 571–579

reliability testing, 567–571

thermal damage to, 587–592

thermal degradation, 583–592

Latchup, 73–74, 648, 694

Latchup paths, 436

Latent

failures, 376–377

reliability defects, 170–171

Lattice

defect nucleation sites, 153

defects, 45, 54, 112–114

imaging, 636

match, 50, 86

mismatch, 138–139

LC, See Liquid crystal ...