Reliability and Failure of Electronic Materials and Devices, 2nd Edition

T

T²L, See Transistor–transistor logic

Ta₂O₅, See Tantalum oxide

TAB, See Tape automated bonding

Tantalum capacitors, 224b

Tantalum oxide (Ta₂O₅), 79

Tape automated bonding (TAB), 455–457

See also Inner lead bonding

bonding, 448

leads, 455

TDDB, See Time-dependent dielectric breakdown

TEM, See Transmission electron microscope

Temperature

creep, 317

cycling, 32

dependence, 535–536

distributions, 540, 657

gradients, 26, 276

stressing, 26

transients, 229–230

Temperature-dependent diffusivity, 269–270

Temperature-dependent nucleation/growth, 220–221

Temperature-ramp resistance analysis to characterize electromigration (TRACE), 295

Temperature-time-environment history, 505

Temperature–acceleration factors, 349–350

Tensile strength levels, 28

Tensile stresses, 136–137

Terminal ...