Reliability and Failure of Electronic Materials and Devices, 2nd Edition

V

Vacancies, 114

buildup, 259

defects, 54

electromigration flux, 510

lifetimes, 281

subsaturation, 281–282

supersaturation, 281–282

transport, 300

Vacancy-interstitial pairs, 115, 423

Vacuum

chucks, 142–143

electronics, 2–3

load locks, 160–162

tube electrodes, 410

Valence

band, 47–48, 51–52

edge, 356

bonds, 44

electrons, 46–47

Valence-band electron excitation, 425

van der Waals (vdW), 153–154

adhesion, 153–154, 156–157

forces, 153–154, 156–157

interactions, 157

Vapor-borne particulates, 149

VC techniques, See Voltage contrast techniques

vdW, See van der Waals

Very large scale integration (VLSI), 198

chips, 147

circuits, 73

plasma etching, 350–351

regime, 261

VHSIC, 198

Via-conductor geometry, 287

Via-hole contact resistance, 648–649

Vias, 100–101, 287, 304–305

Vibrating mass,