Electromigration in Thin Films and Electronic Devices

Contributor contact details

(* = main contact)

Editor

C-U. Kim,     Materials Science and Engineering, The University of Texas at Arlington, 416 Yates Street, Arlington, TX, 76019, USA. E-mail address: [e-mail]

Chapter 1

F. Cacho^* and X. Federspiel,     Reliability Department, STMicroelectronics, Crolles 38926, France. E-mail address: [e-mail]

Chapter 2

D.T. Read^* and V.K. Tewary,     Materials Reliability Division, National Institute of Standards and Technology, Mail Stop 853.05, 325 Broadway, Boulder, Colorado, 80305–3328, USA. E-mail address: [e-mail]

W.H. Gerstle,     Department of Civil Engineering, University of New Mexico, Albuquerque, New Mexico, 87131–0001, USA

Chapter 3

A.M. Maniatty^*,      ...