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Three-dimensional Integrated Circuit Design by Eby G. Friedman, Vasilis F. Pavlidis

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Chapter 4. Interconnect Prediction Models

In deep submicrometer technologies, the interconnect resistance has increased significantly, profoundly affecting the signal propagation characteristics across an IC. On-chip interconnects have, therefore, become the primary focus in modern circuit design. Considering the broad gamut of interconnect issues, such as speed, power consumption, and signal integrity, beginning the interconnect design process early in the overall design cycle can prevent expensive iterations at later design stages, which increase both the design turnaround time and the cost of developing a circuit. Early and accurate estimates of interconnect-related parameters, such as the required metal resources, maximum and average wirelength, ...

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