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Three-dimensional Integrated Circuit Design by Eby G. Friedman, Vasilis F. Pavlidis

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Chapter 2. Manufacturing of 3-D Packaged Systems

With the ongoing demand for greater functionality resulting in polylithic (multiple IC) products, longer off-chip interconnects plague the performance of microelectronic systems. The advent of the system-on-chip (SoC) in the mid-1990s primarily addressed the increasing delay of the off-chip interconnects. Integrating all of the components on a monolithic substrate enhances the overall speed of the system, while decreasing the power consumption. To assimilate disparate technologies, however, several difficulties must be surmounted to achieve high yield for the entire system while mitigating the greater noise coupling among the dissimilar blocks within the system. Additional system requirements for ...

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