Three-dimensional Integrated Circuit Design

Chapter 7. Timing Optimization for Two-Terminal Interconnects

The 3-D interconnect prediction models discussed in Chapter 4 indicate a considerable reduction in interconnect length for 3-D circuits, which can improve the speed and power characteristics of modern integrated circuits. In order to exploit this advantage, numerous physical design techniques for 3-D circuits satisfying a variety of design objectives, such as area, wirelength, routing congestion, and temperature, have been developed. In addition to this important advantage, three-dimensional integration demonstrates many opportunities for heterogeneous SoCs [138].

Integrating circuits from diverse fabrication processes into a single-multiplane system can result, however, in substantially ...