Chapter 8Mitigation Techniques of Failures in Electronic Components and Systems
8.1 Conventional Stack-layer Based Mitigation Techniques, Their Limitations and Improvements
There are a number of conventional mitigation techniques mainly in device/circuit layers [1, 2]. They are mainly against alpha-ray induced soft error in DRAMs (Dynamic Random Access Memories). As neutron-induced soft error becomes imminent, a number of additional mitigation techniques have been proposed in each stack layer basis. Such layer-based mitigation techniques and their limitations are reviewed in this section.
8.1.1 Substrate/Device Level
Table 8.1 summarises traditional and recent prevention, in-situ recovery and off-line recovery techniques in the substrate/device level [3–21].
Table 8.1 List of prevention, in-situ recovery and off-line mitigation techniques against failures in substrate/device level
Layer | Prevention | In-situ recovery | Off-line recovery |
Substrate/well |
|
|
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Device |
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|
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