Book description
Silicon-On-Insulator (SOI) Technology: Manufacture and Applications covers SOI transistors and circuits, manufacture, and reliability. The book also looks at applications such as memory, power devices, and photonics.
The book is divided into two parts; part one covers SOI materials and manufacture, while part two covers SOI devices and applications. The book begins with chapters that introduce techniques for manufacturing SOI wafer technology, the electrical properties of advanced SOI materials, and modeling short-channel SOI semiconductor transistors. Both partially depleted and fully depleted SOI technologies are considered. Chapters 6 and 7 concern junctionless and fin-on-oxide field effect transistors. The challenges of variability and electrostatic discharge in CMOS devices are also addressed. Part two covers recent and established technologies. These include SOI transistors for radio frequency applications, SOI CMOS circuits for ultralow-power applications, and improving device performance by using 3D integration of SOI integrated circuits. Finally, chapters 13 and 14 consider SOI technology for photonic integrated circuits and for micro-electromechanical systems and nano-electromechanical sensors.
The extensive coverage provided by Silicon-On-Insulator (SOI) Technology makes the book a central resource for those working in the semiconductor industry, for circuit design engineers, and for academics. It is also important for electrical engineers in the automotive and consumer electronics sectors.
- Covers SOI transistors and circuits, as well as manufacturing processes and reliability
- Looks at applications such as memory, power devices, and photonics
Table of contents
- Cover image
- Title page
- Copyright
- Contributor contact details
- Woodhead Publishing Series in Electronic and Optical Materials
- Introduction
-
Part I: Silicon-on-insulator (SOI) materials and manufacture
-
1. Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology
- Abstract:
- 1.1 Introduction
- 1.2 SOI wafer fabrication technologies: an overview
- 1.3 SOI volume-fabrication process
- 1.4 SOI wafer structures and characterization
- 1.5 Direct wafer bonding: wet surface cleaning techniques
- 1.6 Characterization of direct bonding mechanisms
- 1.7 Alternative surface preparation processes for Si and SiO2 direct bonding
- 1.8 Mass production of SOI substrates by ion implantation, bonding and splitting: Smart Cut™ technology
- 1.9 Fabrication of more complex SOI structures
- 1.10 Fabrication of heterogeneous structures
- 1.11 Conclusion
- 1.12 Acknowledgments
- 1.13 References
-
2. Characterization of the electrical properties of advanced silicon-on-insulator (SOI) materials and transistors
- Abstract:
- 2.1 Introduction
- 2.2 Conventional characterization techniques
- 2.3 Characterization of SOI wafers using the pseudo-metal oxide semiconductor field effect transister (MOSFET) technique
- 2.4 Developments in the pseudo-MOSFET technique
- 2.5 Conventional methods for the characterization of FD MOSFETs
- 2.6 Advanced methods for the characterization of FD MOSFETs
- 2.7 Characterization of ultrathin SOI MOSFETs
- 2.8 Characterization of multiple-gate MOSFETs
- 2.9 Characterization of nanowire FETs
- 2.10 Conclusions
- 2.11 Acknowledgments
- 2.12 References
- 3. Modeling the performance of short-channel fully depleted silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs)
- 4. Partially depleted (PD) silicon-on-insulator (SOI) technology: circuit solutions
-
5. Planar fully depleted (FD) silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology
- Abstract:
- 5.1 Introduction
- 5.2 Planar FDSOI technology
- 5.3 VT adjustment on FDSOI: channel doping, gate stack engineering and ground planes
- 5.4 Substrate requirements for FDSOI CMOS devices: BOX and channel thicknesses
- 5.5 Strain options on FDSOI
- 5.6 Performance without and with back bias
- 5.7 Conclusion
- 5.8 Acknowledgements
- 5.9 References
- 6. Silicon-on-insulator (SOI) junctionless transistors
- 7. Silicon-on-insulator (SOI) fin-on-oxide field effect transistors (FinFETs)
- 8. Understanding variability in complementary metal oxide semiconductor (CMOS) devices manufactured using silicon-on-insulator (SOI) technology
-
9. Protecting against electrostatic discharge (ESD) in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) manufactured using silicon-on-insulator (SOI) technology
- Abstract:
- 9.1 Introduction
- 9.2 ESD characterization in SOI devices: SOI transistors
- 9.3 ESD characterization in SOI devices: SOI diodes
- 9.4 ESD characterization in SOI devices: fin-on-oxide field effect transistors (FinFETs) and FinDiodes
- 9.5 ESD characterization in SOI devices: fully depleted SOI (FDSOI) devices
- 9.6 ESD network optimization in SOI devices
- 9.7 Conclusion
- 9.8 References
-
1. Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology
-
Part II: Silicon-on-insulator (SOI) devices and applications
-
10. Silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs) for radio frequency (RF) and analogue applications
- Abstract:
- 10.1 Introduction
- 10.2 Current performance of RF devices
- 10.3 Limiting factors in MOSFET performance
- 10.4 Schottky barrier (SB) MOSFETs
- 10.5 Ultra-thin body ultra-thin BOX (UTBB) MOSFETs
- 10.6 RF performance of a multi-gate MOSFET: fin-on-oxide field effect transistor (FinFET)
- 10.7 High-resistivity silicon (HR-Si) substrate for SOI technology
- 10.8 Conclusions
- 10.9 Acknowledgements
- 10.10 References
-
11. Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) circuits for ultralow power (ULP) applications
- Abstract:
- 11.1 Introduction: the importance of ultralow power devices
- 11.2 Minimizing power consumption of CMOS circuits
- 11.3 Issues on Vdd scaling to improve the energy efficiency of CMOS circuits
- 11.4 Developing SOI devices with small variability and adaptive bias control
- 11.5 Modelling variability
- 11.6 Device design for ultralow-voltage operation
- 11.7 Assessing variability in fully depleted silicon-on-insulator (FDSOI) devices
- 11.8 Assessing the reliability of FDSOI devices
- 11.9 Circuit design of FDSOI devices
- 11.10 Future trends
- 11.11 Acknowledgment
- 11.12 References
-
12. 3D integration of silicon-on-insulator (SOI) integrated circuits (ICs) for improved performance
- Abstract:
- 12.1 Introduction
- 12.2 3D integration using Cu–Cu bonding: generic flow techniques
- 12.3 3D integration using Cu–Cu bonding: face-to face silicon layer stacking
- 12.4 3D integration using Cu–Cu bonding: back-to-face silicon layer stacking
- 12.5 3D integration using oxide bonding: the MIT Lincoln Laboratory’s ‘face down’ stacking technique
- 12.6 3D integration using oxide bonding: IBM’s ‘face up’ stacking technique
- 12.7 3D integration using oxide bonding: the sequential 3D process
- 12.8 Advanced bonding technology: Cu–Cu bonding
- 12.9 Advanced bonding technology: dielectric bonding
- 12.10 Summary
- 12.11 Acknowledgements
- 12.12 References
- 13. Silicon-on-insulator (SOI) technology for photonic integrated circuits (PICs)
- 14. Silicon-on-insulator (SOI) technology for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) sensors
-
10. Silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs) for radio frequency (RF) and analogue applications
- Index
Product information
- Title: Silicon-On-Insulator (SOI) Technology
- Author(s):
- Release date: June 2014
- Publisher(s): Woodhead Publishing
- ISBN: 9780857099259
You might also like
book
Emerging Nanoelectronic Devices
Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As …
book
Novel Advances in Microsystems Technologies and Their Applications
Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, …
book
Micro- and Nanoelectronics
Presenting a comprehensive overview of the state of the art of micro- and nanoelectronics, this book …
book
Doherty Power Amplifiers
Doherty Power Amplifiers: From Fundamentals to Advanced Design Methods is a great resource for both RF …