Signal Integrity: From High Speed to Radiofrequency Applications

Contents

Introduction

1 Degradation Of Rise Time In Interconnects

1.1. Propagation issues in interconnects

1.2. Behavior of components at high frequencies

1.3. Effect on transmission of signals on interconnects

1.4. Measurement of rise time

1.5. Conclusion

2 Electromagnetic Modeling of Interconnects

2.1. Global modeling of signal integrity

2.2. RC interconnect model

2.3. Capacitive and inductive modeling

2.4. LC line modeling

2.5. Application to electronic packages and MCM

2.6. Conclusion

3 Controlled Impedance Interconnects

3.1. Why control impedance?

3.2. Influence of rise time on signal degradation

3.3. Model of a controlled impedance interconnect

3.4. Interconnects onPCBs

3.5. Impedance control for a microstrip configuration

3.6. Analysis of propagation in interconnects

3.7. Effect on data bus configuration

3.8. Application to clock distribution

3.9. Conclusion

4 Propagation on Transmission Lines

4.1. Transmission line model

4.2. Propagation modes related to substrate

4.3. Equation of propagation on transmission lines

4.4. Conclusion

5 The S-Parameters Testing Technique

5.1. Definition of measured parameters

5.2. The S-parameters principle

5.3. Measurement of S parameters

5.4. Measurement of characteristic line impedance

5.5. Measurement of line capacitance

5.6. Components on PCB and de-embedding techniques

5.7. Characterization of dielectric materials for interconnects

5.8. Conclusion

6 Time-Domain Reflectometry Analysis

6.1. Principle of TDR

6.2. Reflection and transmission ...