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Signal Integrity: From High Speed to Radiofrequency Applications

Book Description

This book presents the necessary concepts for the design and testing of radiofrequency and high-speed circuits. Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students. The subjects covered include: interconnections and signal integrity; spectral analysis techniques for high-speed signals; design techniques for signal integrity; the transmission-line concept; methods for temporal analysis and techniques for frequency domain analysis for connectics.

Table of Contents

  1. Cover
  2. Contents
  3. Title Page
  4. Copyright
  5. Introduction
  6. 1 Degradation of Rise Time in Interconnects
    1. 1.1. Propagation Issues in Interconnects
    2. 1.2. Behavior of Components at High Frequencies
    3. 1.3. Effect on Transmission of Signals on Interconnects
    4. 1.4. Measurement of Rise Time
    5. 1.5. Conclusion
  7. 2 Electromagnetic Modeling OF Interconnects
    1. 2.1. Global modeling of signal integrity
    2. 2.2. RC Interconnect Model
    3. 2.3. Capacitive and Inductive Modeling
    4. 2.4. LC Line Modeling
    5. 2.5. Application to Electronic Packages and Mcm
    6. 2.6. Conclusion
  8. 3 Controlled Impedance Interconnects
    1. 3.1. Why Control Impedance?
    2. 3.2. Influence of Rise Time on Signal Degradation
    3. 3.3. Model of a Controlled Impedance Interconnect
    4. 3.4. Interconnects on PCBs
    5. 3.5. Impedance Control for a Microstrip Configuration
    6. 3.6. Analysis of Propagation in Interconnects
    7. 3.7. Effect on Data Bus Configuration
    8. 3.8. Application to Clock Distribution
    9. 3.9. Conclusion
  9. 4 Propagation on Transmission Lines
    1. 4.1. Transmission Line Model
    2. 4.2. Propagation Modes Related to Substrate
    3. 4.3. Equation of Propagation on Transmission Lines
    4. 4.4. Conclusion
  10. 5 THE S-Parameters Testing Technique
    1. 5.1. Definition of Measured Parameters
    2. 5.2. The S-parameters Principle
    3. 5.3. Measurement of S Parameters
    4. 5.4. Measurement of Characteristic Line Impedance
    5. 5.5. Measurement of Line Capacitance
    6. 5.6. Components on PCB and De-Embedding Techniques
    7. 5.7. Characterization of Dielectric Materials for Interconnects
    8. 5.8. Conclusion
  11. 6 Time-Domain Reflectometry Analysis
    1. 6.1. Principle of TDR
    2. 6.2. Reflection and Transmission of Voltage
    3. 6.3. Measurement of Characteristic Impedance
    4. 6.4. Reflection on Reactive Loads
    5. 6.5. Extraction of equivalent schemas
    6. 6.6. Discontinuities in Cascade
    7. 6.7. Conclusion
  12. 7 Interference and Cross-Talk In Interconnects
    1. 7.1. Coupling and Interferences Due to Substrate
    2. 7.2. Theory of Coupling Between Lines
    3. 7.3. Application to High-Speed Cables, Buses and Connectors
    4. 7.4. Conclusion
  13. Bibliography
  14. Index