Book description
An up-to-date, comprehensive guide to heterojunction bipolar transistor technology.
Owing to their superior performance in microwave and millimeter-wave applications, heterojunction bipolar transistors (HBTs) have become a major force in mobile and wireless communications. This book offers an integrated treatment of SiGe, GaAs, and InP HBTs, presenting a much-needed overview of HBTs based on different materials systems-their fabrication, analysis, and testing procedures.
Highly respected expert Jiann S. Yuan discusses in depth the dc and RF performance and modeling of HBT devices, including simulation, thermal instability, reliability, low-temperature and high-temperature performance, and HBT analog and digital circuits. He provides step-by-step presentations of HBT materials-including Si HBTs and III-V and IV-IV compound HBTs, which are rarely described in the literature. Also covered are device and circuit interaction as well as specific high-speed devices in mobile and wireless communications.
This immensely useful guide to a rapidly expanding field includes more than 200 figures, tables of different material systems in terms of their physical parameters, and up-to-date experimental results culled from the latest research. An essential resource for circuit and device designers in the semiconductor industry, SiGe, GaAs, and InP Heterojunction Bipolar Transistors is also useful for graduate students in electrical engineering, applied physics, and materials science.
Table of contents
- Coverpage
- Titlepage
- Copyright
- Dedication
- Contents
- Preface
- About the Author
- 1 Introduction
- 2 Material Properties and Technologies
-
3 DC Performance
-
3.1 General Structures and Steady-State Behavior
- 3.1.1 Electron and Hole Currents
- 3.1.2 Abrupt and Graded Heterojunctions
- 3.1.3 Undoped Setback Layer
- 3.1.4 Graded-Base HBTs
- 3.1.5 Double Heterojunctions
- 3.1.6 Electron Quasi-Fermi Level Splitting
- 3.1.7 Collector–Emitter Offset Voltage
- 3.1.8 Early Voltage
- 3.1.9 Bias-Dependent Base Resistance
- 3.1.10 High Injection Barrier Effect
- 3.2 SiGe Heterojunction Bipolar Transistors
- 3.3 III/V Compound Heterojunction Bipolar Transistors
- References
- Problems
-
3.1 General Structures and Steady-State Behavior
-
4 RF and Transient Performance
-
4.1 General Device Behavior
- 4.1.1 Output Conductance
- 4.1.2 Transconductance
- 4.1.3 Heterojunction Junction Capacitance
- 4.1.4 Base Transit Time
- 4.1.5 Collector-Base Space-Charge-Layer Delay
- 4.1.6 Cutoff Frequency
- 4.1.7 Maximum Frequency of Oscillation
- 4.1.8 NPN Versus PNP on RF Performance
- 4.1.9 Collector-Up Versus Collector-Down Influence on RF Performance
- 4.1.10 Noise
- 4.1.11 S-Parameters
- 4.1.12 Turn-off Transient
-
4.2 Silicon–Germanium Heterojunction Bipolar Transistors
- 4.2.1 Effect of Ge Profiles on go and τB
- 4.2.2 Effect of Ge Profiles on fT and fmax
- 4.2.3 Effect of Inverse Base Width Modulation on τB and τC
- 4.2.4 Transconductance Degradation at High Current Densities and Low Temperatures
- 4.2.5 Ge and Collector Doping Profile Design to Improve the Clipping Effect
- 4.3 III/V Compound Heterojunction Bipolar Transistors
- References
- Problems
-
4.1 General Device Behavior
-
5 HBT Modeling
- 5.1 Silicon–Germanium HBT Models
-
5.2 III/V Compound HBT Models
- 5.2.1 Thermionic-Field-Diffusion Model
- 5.2.2 Grinberg–Luryi Physics-Based Collector Current Model
- 5.2.3 New Charge-Control Model
- 5.2.4 Base Recombination Currents
- 5.2.5 Analytical Collector Current Model, Including the Self-Heating Effect
- 5.2.6 Compact Gummel-Poon Model, Including the Self-Heating Effect
- 5.3 Large- and Small-Signal Models for RF Applications
- 5.4 Parameter Extraction
- References
- Problems
- 6 Heterojunction Device Simulation
-
7 Breakdown and Thermal Instability
-
7.1 Avalanche Breakdown
- 7.1.1 Reverse Base Current Phenomenon
- 7.1.2 Nonlocal Avalanche Effect
- 7.1.3 Influence of the Base Thickness on the Collector Breakdown
- 7.1.4 Avalanche Effect on the Collector-Base Junction Capacitance
- 7.1.5 Avalanche Effect on the Output Conductance
- 7.1.6 Breakdown and Speed Considerations in InGaAs HBTs
- 7.2 Thermal Instability
- 7.3 Design In Thermal Stability
- References
- Problems
-
7.1 Avalanche Breakdown
- 8 Reliability
- 9 RF and Digital Circuits for Low-Voltage Applications
- Index
Product information
- Title: SiGe, GaAs, and InP Heterojunction Bipolar Transistors
- Author(s):
- Release date: April 1999
- Publisher(s): Wiley-Interscience
- ISBN: 9780471197461
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