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RF Circuit Design, 2nd Edition

Book Description

Summarizes the schemes and technologies in RF circuit design, describes the basic parameters of an RF system and the fundamentals of RF system design, and presents an introduction of the individual RF circuit block design.

Forming the backbone of today's mobile and satellite communications networks, radio frequency (RF) components and circuits are incorporated into everything that transmits or receives a radio wave, such as mobile phones, radio, WiFi, and walkie talkies. RF Circuit Design, Second Edition immerses practicing and aspiring industry professionals in the complex world of RF design.

Completely restructured and reorganized with new content, end-of-chapter exercises, illustrations, and an appendix, the book presents integral information in three complete sections:

  • Part One explains the different methodologies between RF and digital circuit design and covers voltage and power transportation, impedance matching in narrow-band case and wide-band case, gain of a raw device, measurement, and grounding. It also goes over equipotentiality and current coupling on ground surface, as well as layout and packaging, manufacturability of product design, and radio frequency integrated circuit (RFIC).

  • Part Two includes content on the main parameters and system analysis in RF circuit design, the fundamentals of differential pair and common-mode rejection ratio (CMRR), Balun, and system-on-a-chip (SOC).

  • Part Three covers low-noise amplifier (LNA), power amplifier (PA), voltage-controlled oscillator (VCO), mixers, and tunable filters.

  • RF Circuit Design, Second Edition is an ideal book for engineers and managers who work in RF circuit design and for courses in electrical or electronic engineering.

    Table of Contents

    1. Cover
    2. Title Page
    3. Copyright
    4. Chapter PR: Preface to the Second Edition
    5. Part 1: Design Technologies and Skills
      1. Chapter 1: Difference between RF and Digital Circuit Design
        1. 1.1 Controversy
        2. 1.2 Difference of RF and Digital Block in a Communication System
        3. 1.3 Conclusions
        4. 1.4 Notes for High-Speed Digital Circuit Design
      2. Chapter 2: Reflection and Self-interference
        1. 2.1 Introduction
        2. 2.2 Voltage Delivered from a Source to a Load
        3. 2.3 Power Delivered from a Source to A Load
        4. 2.4 Impedance Conjugate Matching
        5. 2.5 Additional Effect of Impedance Matching
        6. Appendices
      3. Chapter 3: Impedance Matching In The Narrow-Band Case
        1. 3.1 Introduction
        2. 3.2 Impedance Matching By Means Of Return Loss Adjustment
        3. 3.3 Impedance Matching Network Built By One Part
        4. 3.4 Impedance Matching Network Built By Two Parts
        5. 3.5 Impedance Matching Network Built By Three Parts
        6. 3.6 Impedance Matching When ZS Or ZL Is Not 50 Ω
        7. 3.7 Parts In An Impedance Matching Network
        8. Appendices
      4. Chapter 4: Impedance Matching in the Wideband Case
        1. 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart
        2. 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch
        3. 4.3 Impedance Variation Due to the Insertion of Two Parts Per Arm or Per Branch
        4. 4.4 Partial Impedance Matching for an IQ (in Phase Quadrature) Modulator in a UWB (ultra wide band) System
        5. 4.5 Discussion of Passive Wideband Impedance Matching Network
      5. Chapter 5: Impedance and Gain of a Raw Device
        1. 5.1 Introduction
        2. 5.2 Miller Effect
        3. 5.3 Small-signal Model of a Bipolar Transistor
        4. 5.4 Bipolar Transistor with CE (Common Emitter) Configuration
        5. 5.5 Bipolar Transistor with CB (Common Base) Configuration
        6. 5.6 Bipolar Transistor with CC (Common COLLECTOR) Configuration
        7. 5.7 Small-signal Model of a Mosfet
        8. 5.8 Similarity Between a Bipolar Transistor and a Mosfet
        9. 5.9 Mosfet with CS (Common Source) Configuration
        10. 5.10 Mosfet with CG (Common Gate) Configuration
        11. 5.11 Mosfet with CD (Common Drain) Configuration
        12. 5.12 Comparison of Transistor Configuration of Single-stage Amplifiers with Different Configurations
      6. Chapter 6: Impedance Measurement
        1. 6.1 Introduction
        2. 6.2 Scalar and Vector Voltage Measurement
        3. 6.3 Direct Impedance Measurement by a Network Analyzer
        4. 6.4 Alternative Impedance Measurement by Network Analyzer
        5. 6.5 Impedance Measurement Using a Circulator
        6. 6.6 Appendices
      7. Chapter 7: Grounding
        1. 7.1 Implication of Grounding
        2. 7.2 Possible Grounding Problems Hidden in a Schematic
        3. 7.3 Imperfect or Inappropriate Grounding Examples
        4. 7.4 ‘Zero’ Capacitor
        5. 7.5 Quarter Wavelength of Microstrip Line
        6. 7.6 Appendices
      8. Chapter 8: Equipotentiality and Current Coupling on the Ground Surface
        1. 8.1 Equipotentiality on the Ground Surface
        2. 8.2 Forward and Return Current Coupling
        3. 8.3 PCB or IC Chip with Multimetallic Layers
      9. Chapter 9: Layout
        1. 9.1 Difference in Layout between an Individual Block and a System
        2. 9.2 Primary Considerations of a PCB
        3. 9.3 Layout of a PCB for Testing
        4. 9.4 VIA Modeling
        5. 9.5 Runner
        6. 9.6 Parts
        7. 9.7 Free Space
      10. Chapter 10: Manufacturability of Product Design
        1. 10.1 Introduction
        2. 10.2 Implication of 6σ Design
        3. 10.3 Approaching 6σ Design
        4. 10.4 Monte Carlo Analysis
        5. 10.5 Appendices
      11. Chapter 11: RFIC (Radio Frequency Integrated Circuit)
        1. 11.1 Interference and Isolation
        2. 11.2 Shielding for an RF Module by a Metallic Shielding Box
        3. 11.3 Strong Desirability to Develop RFIC
        4. 11.4 Interference going along IC Substrate Path
        5. 11.5 Solution for Interference Coming from Sky
        6. 11.6 Common Grounding Rules for RF Module and RFIC Design
        7. 11.7 Bottlenecks in RFIC Design
        8. 11.8 Calculating of Quarter Wavelength
    6. Part 2: RF System
      1. Chapter 12: Main Parameters and System Analysis in RF Circuit Design
        1. 12.1 Introduction
        2. 12.2 Power Gain
        3. 12.3 Noise
        4. 12.4 Nonlinearity
        5. 12.5 Other Parameters
        6. 12.6 Example of RF System Analysis
        7. 12.7 Appendices
      2. Chapter 13: Speciality of “Zero if” System
        1. 13.1 Why Differential Pair?
        2. 13.2 Can DC Offset be Blocked out by a Capacitor?
        3. 13.3 Chopping Mixer
        4. 13.4 DC Offset Cancellation by Calibration
        5. 13.5 Remark on DC Offset Cancellation
      3. Chapter 14: Differential Pairs
        1. 14.1 Fundamentals of Differential Pairs
        2. 14.2 CMRR (Common Mode Rejection Ratio)
      4. Chapter 15: RF Balun
        1. 15.1 Introduction
        2. 15.2 Transformer Balun
        3. 15.3 LC Balun
        4. 15.4 Microstrip Line Balun
        5. 15.5 Mixing Type of Balun
        6. Appendices
      5. Chapter 16: SOC (System-on-a-Chip) and Next
        1. 16.1 SOC
        2. 16.2 What is Next
        3. Appendices
    7. Part 3: Individual RF Blocks
      1. Chapter 17: LNA (Low-Noise Amplifier)
        1. 17.1 Introduction
        2. 17.2 Single-Ended Single Device LNA
        3. 17.3 Single-Ended Cascode LNA
        4. 17.4 LNA with AGC (Automatic Gain Control)
      2. Chapter 18: Mixer
        1. 18.1 Introduction
        2. 18.2 Passive Mixer
        3. 18.3 Active Mixer
        4. 18.4 Design Schemes
        5. Appendices
      3. Chapter 19: Tunable Filter
        1. 19.1 Tunable Filter in A Communication System
        2. 19.2 Coupling between two Tank Circuits
        3. 19.3 Circuit Description
        4. 19.4 Effect of Second Coupling
        5. 19.5 Performance
      4. Chapter 20: VCO (Voltage-Controlled Oscillator)
        1. 20.1 “Three-Point” Types of Oscillator
        2. 20.2 Other Single-Ended Oscillators
        3. 20.3 VCO and PLL (Phase Lock Loop)
        4. 20.4 Design Example of a Single-Ended VCO
        5. 20.5 Differential VCO and Quad-Phases VCO
      5. Chapter 21: PA (Power Amplifier)
        1. 21.1 Classification of PA
        2. 21.2 Single-ENDED PA
        3. 21.3 Single-ENDED PA IC DESIGN
        4. 21.4 Push–PULL PA Design
        5. 21.5 PA with Temperature Compensation
        6. 21.6 PA with Output Power Control
        7. 21.7 LINEAR PA
    8. Index