Reliability Characterisation of Electrical and Electronic Systems

Table of contents

1. Cover image
2. Title page
3. Table of Contents
4. Copyright
5. List of contributors
6. Woodhead Publishing Series in Electronic and Optical Materials
7. Foreword
8. 1: Introduction
   1. Abstract
   2. 1.1 Introduction
   3. 1.2 The focus of the book
   4. 1.3 Reliability science and engineering fundamentals (Chapters 2–4)
   5. 1.4 Reliability methods in component and system development (Chapters 5–9)
   6. 1.5 Reliability modelling and testing in specific applications (Chapters 10 and 11)
   7. 1.6 Conclusion
9. 2: Reliability and stupidity: mistakes in reliability engineering and how to avoid them
   1. Abstract
   2. 2.1 Introduction
   3. 2.2 Common mistakes in reliability engineering
   4. 2.3 Conclusion
10. 3: Physics-of-failure (PoF) methodology for electronic reliability
    1. Abstract
    2. 3.1 Introduction
    3. 3.2 Reliability
    4. 3.3 PoF models
    5. 3.4 PoF reliability assessment
    6. 3.5 Applications of PoF to ensure reliability
    7. 3.6 Summary and areas of future interest
11. 4: Modern instruments for characterizing degradation in electrical and electronic equipment
    1. Abstract
    2. 4.1 Introduction
    3. 4.2 Destructive techniques
    4. 4.3 Nondestructive techniques
    5. 4.4 In situ measurement techniques
    6. 4.5 Conclusions
12. 5: Reliability building of discrete electronic components
    1. Abstract
    2. 5.1 Introduction
    3. 5.2 Reliability building
    4. 5.3 Failure risks and possible corrective actions
    5. 5.4 Effect of electrostatic discharge on discrete electronic components
    6. 5.5 Conclusions
13. 6: Reliability of optoelectronics
    1. Abstract
    2. 6.1 Introduction
    3. 6.2 Overview of optoelectronics reliability
    4. 6.3 Approaches and recent developments
    5. 6.4 Case study: reliability of buried heterostructure (BH) InP semiconductor lasers
    6. 6.5 Reliability extrapolation and modeling
    7. 6.6 Electrostatic discharge (ESD) and electrical overstress (EOS)
    8. 6.7 Conclusions
14. 7: Reliability of silicon integrated circuits
    1. Abstract
    2. Acknowledgments
    3. 7.1 Introduction
    4. 7.2 Reliability characterization approaches
    5. 7.3 Integrated circuit (IC) wear-out failure mechanisms
    6. 7.4 Summary and conclusions
15. 8: Reliability of emerging nanodevices
    1. Abstract
    2. 8.1 Introduction to emerging nanodevices
    3. 8.2 Material and architectural evolution of nanodevices
    4. 8.3 Failure mechanisms in nanodevices
    5. 8.4 Reliability challenges: opportunities and issues
    6. 8.5 Summary and conclusions
16. 9: Design considerations for reliable embedded systems
    1. Abstract
    2. 9.1 Introduction
    3. 9.2 Hardware faults
    4. 9.3 Reliable design principles
    5. 9.4 Low-cost reliable design
    6. 9.5 Future research directions
    7. 9.6 Conclusions
17. 10: Reliability approaches for automotive electronic systems
    1. Abstract
    2. Acknowledgment
    3. 10.1 Introduction
    4. 10.2 Circuit reliability challenges for the automotive industry
    5. 10.3 Circuit reliability checking for the automotive industry
    6. 10.4 Using advanced electronic design automation (EDA) tools
    7. 10.5 Case studies and examples
    8. 10.6 Conclusion
18. 11: Reliability modeling and accelerated life testing for solar power generation systems
    1. Abstract
    2. 11.1 Introduction
    3. 11.2 Overview
    4. 11.3 Challenges
    5. 11.4 Modeling
    6. 11.5 Accelerated life testing (ALT)
    7. 11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism
    8. 11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion
    9. 11.8 Developments and opportunities
    10. 11.9 Conclusions
    11. 11.10 Sources of further information
19. Index