Acronyms

A Amps, Amperes
AlAs Aluminum arsenide
AlGaAs Aluminum gallium arsenide
ASIC Application-specific integrated circuit
ATI Automatic test instrument
B Boron
BEOL Back end of line
CCD Charge-coupled device
CD Compact disc
CDF Cumulative distribution function
CMOS Complementary metal oxide semiconductor
CMP Chemical mechanical polishing
CVD Chemical vapor deposition
DRAM Dynamic random access memory
DUT Device under test
DVD Digital video disc
EEPROM Electrically erasable programmable read only memory
ELSI Extreme-large-scale integration
EM Electromigration
EOS Electrical overstress
ESD Electrostatic discharge
FEOL Front end of line
FIT Failure in time, failure in 10th to the 9th device hours
GaAs Gallium arsenide
GaInAsP Gallium indium arsenic phosphide
GB Grain ...

Get Reliability and Failure of Electronic Materials and Devices, 2nd Edition now with the O’Reilly learning platform.

O’Reilly members experience books, live events, courses curated by job role, and more from O’Reilly and nearly 200 top publishers.