RapidIO: The Next Generation Communication Fabric For Embedded Application

16.4. SUMMARY

As system performance requirements of embedded equipment increases, there are several concurrent efforts in the industry to either migrate or replace existing bus-based mechanical standards with new standards that support the high-speed differential signaling used by the RapidIO interconnect technology and other similar technologies. Existing design techniques and board and connector technologies will impose limits with respect to the frequency and hence bandwidth available on the differential links. These limits are driving several well-funded efforts focused on the creation of new PCB materials, layout techniques and new connector technologies to support signaling speeds up to 10 Gbps for a single differential signal pair.