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Power Integrity Modeling and Design for Semiconductors and Systems by A. Ege Engin, Madhavan Swaminathan

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Chapter 5. Applications

5.1. Introduction

In this chapter, several examples are presented to illustrate the use of the methods described in the previous chapters for modeling power distribution structures. Each example was carefully chosen to illustrate a specific behavior or methodology. Some of these applications discuss typical issues arising in high-speed products; others discuss new technologies. The first three examples deal with analysis of chip packages or printed circuit boards (PCBs) for high-speed applications with regard to signal and power integrity. The last three examples deal with new material technologies and structures that help with power integrity.

The first example is a multilayered board that supports a high-frequency microprocessor. ...

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