Chapter 3. Physical Network Layer[*]
Recent drive for “smaller, faster, cooler and cheaper” semiconductor technology achieves commercialization of 65 nm process and soon 45 nm process will be adopted in mass production by the industry [23]. Such deep submicron (DSM) technology brings up many new challenges and an increase of uncertainty (i.e., unpredictability) in process, design and market. The precise control of the fabrication process is almost impossible so that fluctuation of the dopant concentration, variation of the photolithographic resolution and thin film thicknesses are indispensable and become the causes of uncertainties in threshold, gm and IDSAT of MOSFET. The same problems can take place to interconnection lines implemented with ...
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