C.H. Wang, Heriot-Watt University, UK
This chapter presents the development of laser-based methods for assembly of photonic devices. This includes the development of laser-assisted polymer bonding methods for assembly and packaging of photonic and microelectromechanical systems (MEMS) devices and the associated temperature monitoring method using embedded microsensors. The chapter also covers an overview of the development of a laser microwelding method for assembly of polymer spheres to create photonic bandgap materials for terahertz applications.