Chapter 1. zSeries 900 overview 3
1.2 z900 family models
The z900 has a total of 42 models to offer flexibility in selecting a system to meet the
customer's needs. Forty-one of the models are general purpose and capacity servers. The
remaining model is the Coupling Facility Model 100. There are a wide range of upgrade
options available, which are described on the following pages. Capacity Upgrade on Demand
(CUoD), Customer Initiated Upgrades (CIU), and Capacity BackUp (CBU) are available. The
z900 has also been designed to offer high performance and efficient I/O structure to meet the
demands of e-business, as well as high demand transaction processing applications. Up to
256 ESCON channels will now fit into a single I/O cage; or a total of 96 FICON and/or FCP
channels and 160 ESCON channels can be accommodated in a fully configured system.
To provide the best choice of processor for the application, two packaging options have been
developed. Although similar in structure, one packaging has a 12-Processor Unit (PU)
MultiChip Module (MCM) and two memory cards. The other packaging has a 20-PU MCM
and four memory cards. Both have equivalent I/O capability. The processor models and a
discussion of configurations follow.
The z900 has two different system infrastructures. These are:
The model range that supports a 12-PU MCM.
The model range that supports a 20-PU non-Turbo or Turbo MCM.
Figure 1-1 Models in the z900 family of processors
Turbo Models
CMOS 8SE (Copper and SOI)
20 PUs
Up to 16 CPs or 15 IFLs/ICFs
10 - 64 GB Memory
1.09 ns cycle time
Modular Cooling Unit (MCU)
CMOS 8S (Copper interconnect)
12 PUs
Up to 9 CPs or 8 IFLs/ICFs
5 - 32 GB Memory
1.3 ns cycle time
Modular Cooling Unit (MCU)
101
102
103
104
105
106
107
108
109
100
CMOS 8S (Copper interconnect)
20 PUs
Up to 16 CPs or 15 IFLs/ICFs
10 - 64 GB Memory
1.3 ns cycle time
Modular Cooling Unit (MCU)
2C1
2C2
2C3
2C4
2C5
2C6
2C7
2C8
2C9
210
211
212
213
214
215
216
1C1
1C2
1C3
1C4
1C5
1C6
1C7
1C8
1C9
110
111
112
113
114
115
116
Capacity Models
CF Model
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