This chapter explains the various problems that mobile forensic examiners can expect to encounter. To provide clarity to the issues, the chapter will explain NAND, NOR, embedded multimedia card, embedded multichip package, and multichip package memory configurations. The NAND spare area, along with NAND blocks, wear leveling, and garbage collection will also be addressed. Data encoding and decoding and examples of various artifacts from physical acquisition processing. This will include Joint Test Action Group and Advanced Chip Off binary pulls. The chapter also covers various Epoch issues on mobile devices and concludes with ways in which user enabled security can be defeated or bypassed.