Chapter Thirty Nine. Via Technologies for MEMS

Advanced packaging methods are needed to make miniaturized integrated devices containing chips that have been fabricated using various technologies. Wafer level 3-dimensional (3D) integration is an emerging technology where planar devices on wafers are stacked and interconnected using through wafer vias (Figure 39.1). The main drivers for 3D integration are better electrical performance, lower power consumption and noise, improvement of form factor, lower cost and increase of the functionality of a device. 3D integration is a hot research and development topic because of huge market potential for 3D stacking and heterogeneous integration of various materials and devices. Today, this technology already ...

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