Chapter Twenty Two. MEMS Lithography
Optical lithography is the mainstay of patterning in MEMS: 1X contact/proximity exposure and, to a lesser extent, 5X reduction step-and-repeat systems constitute the bulk of all patterning steps. MEMS patterning is not driven by exposure wavelength reduction and related resolution improvement, but rather by process robustness, etch resistance, thick resists, double-side alignment, and the special needs for severely 3D structures. This chapter discusses lithography in four sections:
- issues to be answered before wafer processing begins;
- issues during lithography process;
- photoresist behavior in the process steps after lithography;
- special issues concerning thick photoresists.
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