Book description
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:
- Silicon as MEMS material
- Material properties and measurement techniques
- Analytical methods used in materials characterization
- Modeling in MEMS
- Measuring MEMS
- Micromachining technologies in MEMS
- Encapsulation of MEMS components
- Emerging process technologies, including ALD and porous silicon
Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.
- Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
- Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
- Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
- Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.
• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Table of contents
- Handbook of Silicon Based MEMS Materials and Technologies
- Brief Table of Contents
- Table of Contents
- Front-matter
- Copyright
- Preface
- List of Contributors
- Impact of Silicon MEMS—30 Years After
- Bibliography
- References
- Part I. Silicon as MEMS Material
- Chapter One. Properties of Silicon
- Bibliography
- References
- Chapter Two. Czochralski Growth of Silicon Crystals
- Bibliography
- References
- Chapter Three. Properties of Silicon Crystals
- Bibliography
- References
- Chapter Four. Oxygen in Silicon
- Bibliography
- References
- Chapter Five. Silicon Wafers - Preparation and Properties
- Bibliography
- References
- Chapter Six. Epi Wafers - Preparation and Properties
- Bibliography
- References
- Chapter Seven. Thick-Film SOI Wafers - Preparation and Properties
- Bibliography
- References
- Chapter Eight. Silicon Dioxides
- Bibliography
- References
- Part II. Modeling in MEMS
- Chapter Nine. Multiscale Modeling Methods
- Bibliography
- References
- Chapter Ten. Manufacture and Processing of MEMS Structures
- Bibliography
- References
- Chapter Eleven. Mechanical Properties of Silicon Microstructures
- Bibliography
- References
- Chapter Twelve. Electrostatic and RF-Properties of MEMS Structures
- Bibliography
- References
- Chapter Thirteen. Optical Modeling of MEMS
- Bibliography
- References
- Chapter Fourteen. Gas Damping in Vibrating MEMS Structures
- Bibliography
- References
- Part III. Measuring MEMS
- Chapter Fifteen. Introduction to Measuring MEMS
- Bibliography
- References
- Chapter Sixteen. Silicon Wafer and Thin Film Measurements
- Bibliography
- References
- Chapter Seventeen. Optical Measurement of Static and Dynamic Displacement in MEMS
- Bibliography
- References
- Chapter Eighteen. MEMS Residual Stress Characterization - Methodology and Perspective
- Bibliography
- References
- Chapter Nineteen. Strength of Bonded Interfaces
- Bibliography
- References
- Chapter Twenty. Focused Ion and Electron Beam Techniques
- Bibliography
- Reference
- Part IV. Micromachining Technologies in MEMS
- Chapter Twenty One. Oxygen and Bulk Microdefects in Silicon
- Bibliography
- References
- Chapter Twenty Two. MEMS Lithography
- Bibliography
- References
- Chapter Twenty Three. Deep Reactive Ion Etching
- Bibliography
- References
- Chapter Twenty Four. Wet Etching of Silicon
- Bibliography
- References
- Chapter Twenty Five. Porous Silicon Based MEMS
- Bibliography
- References
- Chapter Twenty Six. Atomic Layer Deposition in MEMS Technology
- Bibliography
- References
- Chapter Twenty Seven. Metallic Glass
- Bibliography
- References
- Chapter Twenty Eight. Surface Micromachining
- Bibliography
- References
- Chapter Twenty Nine. Silicon Based BioMEMS - Micromachining Technologies
- Bibliography
- References
- Part V. Encapsulation of MEMS Components
- Chapter Thirty. Introduction to Encapsulation of MEMS
- Bibliography
- References
- Chapter Thirty One. Silicon Direct Bonding
- Bibliography
- References
- Chapter Thirty Two. Anodic Bonding
- Bibliography
- References
- Chapter Thirty Three. Glass Frit Bonding
- Bibliography
- References
- Chapter Thirty Four. Metallic Alloy Seal Bonding
- Bibliography
- References
- Chapter Thirty Five. Bonding of CMOS Processed Wafers
- Bibliography
- References
- Chapter Thirty Six. Non-destructive Bond Strength Testing of Anodic Bonded Wafers
- Bibliography
- References
- Chapter Thirty Seven. Wafer-Bonding Equipment
- Bibliography
- References
- Chapter Thirty Eight. Encapsulation by Film Deposition
- Bibliography
- References
- Chapter Thirty Nine. Via Technologies for MEMS
- Bibliography
- References
- Chapter Forty. Outgassing and Gettering
- Bibliography
- References
- Chapter Forty One. Dicing of MEMS Devices
- Bibliography
- References
- Chapter Forty Two. Hermeticity Tests
- Bibliography
- References
- Appendix 1. Common Abbreviations and Acronyms
- Appendix 2. Nanoindentation Characterization of Silicon and other MEMS Materials
- Bibliography
- References
Product information
- Title: Handbook of Silicon Based MEMS Materials and Technologies
- Author(s):
- Release date: January 2010
- Publisher(s): William Andrew
- ISBN: 9780815519881
You might also like
book
Nanotechnology and Functional Materials for Engineers
Nanotechnology and Functional Materials for Engineers focuses on key essentials and examples across the spectrum of …
book
Silicon Technologies: Ion Implantation and Thermal Treatment
The main purpose of this book is to remind new engineers in silicon foundry, the fundamental …
book
Dielectric Materials for Electrical Engineering
Part 1 is particularly concerned with physical properties, electrical ageing and modeling with topics such as …
book
Dark Silicon and Future On-chip Systems
Dark Silicon and the Future of On-chip Systems, Volume 110 , the latest release in the …