You are previewing Handbook of Silicon Based MEMS Materials and Technologies.
O'Reilly logo
Handbook of Silicon Based MEMS Materials and Technologies

Book Description

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.

Key topics covered include:

  • Silicon as MEMS material
  • Material properties and measurement techniques
  • Analytical methods used in materials characterization
  • Modeling in MEMS
  • Measuring MEMS
  • Micromachining technologies in MEMS
  • Encapsulation of MEMS components
  • Emerging process technologies, including ALD and porous silicon

Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

  • Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
  • Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
  • Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
  • Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.


• Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
• Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
• Discusses properties, preparation, and growth of silicon crystals and wafers
• Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Table of Contents

  1. Handbook of Silicon Based MEMS Materials and Technologies
  2. Brief Table of Contents
  3. Table of Contents
  4. Front-matter
  5. Copyright
  6. Preface
  7. List of Contributors
  8. Impact of Silicon MEMS—30 Years After
  9. Bibliography
  10. References
  11. Part I. Silicon as MEMS Material
  12. Chapter One. Properties of Silicon
  13. Bibliography
  14. References
  15. Chapter Two. Czochralski Growth of Silicon Crystals
  16. Bibliography
  17. References
  18. Chapter Three. Properties of Silicon Crystals
  19. Bibliography
  20. References
  21. Chapter Four. Oxygen in Silicon
  22. Bibliography
  23. References
  24. Chapter Five. Silicon Wafers - Preparation and Properties
  25. Bibliography
  26. References
  27. Chapter Six. Epi Wafers - Preparation and Properties
  28. Bibliography
  29. References
  30. Chapter Seven. Thick-Film SOI Wafers - Preparation and Properties
  31. Bibliography
  32. References
  33. Chapter Eight. Silicon Dioxides
  34. Bibliography
  35. References
  36. Part II. Modeling in MEMS
  37. Chapter Nine. Multiscale Modeling Methods
  38. Bibliography
  39. References
  40. Chapter Ten. Manufacture and Processing of MEMS Structures
  41. Bibliography
  42. References
  43. Chapter Eleven. Mechanical Properties of Silicon Microstructures
  44. Bibliography
  45. References
  46. Chapter Twelve. Electrostatic and RF-Properties of MEMS Structures
  47. Bibliography
  48. References
  49. Chapter Thirteen. Optical Modeling of MEMS
  50. Bibliography
  51. References
  52. Chapter Fourteen. Gas Damping in Vibrating MEMS Structures
  53. Bibliography
  54. References
  55. Part III. Measuring MEMS
  56. Chapter Fifteen. Introduction to Measuring MEMS
  57. Bibliography
  58. References
  59. Chapter Sixteen. Silicon Wafer and Thin Film Measurements
  60. Bibliography
  61. References
  62. Chapter Seventeen. Optical Measurement of Static and Dynamic Displacement in MEMS
  63. Bibliography
  64. References
  65. Chapter Eighteen. MEMS Residual Stress Characterization - Methodology and Perspective
  66. Bibliography
  67. References
  68. Chapter Nineteen. Strength of Bonded Interfaces
  69. Bibliography
  70. References
  71. Chapter Twenty. Focused Ion and Electron Beam Techniques
  72. Bibliography
  73. Reference
  74. Part IV. Micromachining Technologies in MEMS
  75. Chapter Twenty One. Oxygen and Bulk Microdefects in Silicon
  76. Bibliography
  77. References
  78. Chapter Twenty Two. MEMS Lithography
  79. Bibliography
  80. References
  81. Chapter Twenty Three. Deep Reactive Ion Etching
  82. Bibliography
  83. References
  84. Chapter Twenty Four. Wet Etching of Silicon
  85. Bibliography
  86. References
  87. Chapter Twenty Five. Porous Silicon Based MEMS
  88. Bibliography
  89. References
  90. Chapter Twenty Six. Atomic Layer Deposition in MEMS Technology
  91. Bibliography
  92. References
  93. Chapter Twenty Seven. Metallic Glass
  94. Bibliography
  95. References
  96. Chapter Twenty Eight. Surface Micromachining
  97. Bibliography
  98. References
  99. Chapter Twenty Nine. Silicon Based BioMEMS - Micromachining Technologies
  100. Bibliography
  101. References
  102. Part V. Encapsulation of MEMS Components
  103. Chapter Thirty. Introduction to Encapsulation of MEMS
  104. Bibliography
  105. References
  106. Chapter Thirty One. Silicon Direct Bonding
  107. Bibliography
  108. References
  109. Chapter Thirty Two. Anodic Bonding
  110. Bibliography
  111. References
  112. Chapter Thirty Three. Glass Frit Bonding
  113. Bibliography
  114. References
  115. Chapter Thirty Four. Metallic Alloy Seal Bonding
  116. Bibliography
  117. References
  118. Chapter Thirty Five. Bonding of CMOS Processed Wafers
  119. Bibliography
  120. References
  121. Chapter Thirty Six. Non-destructive Bond Strength Testing of Anodic Bonded Wafers
  122. Bibliography
  123. References
  124. Chapter Thirty Seven. Wafer-Bonding Equipment
  125. Bibliography
  126. References
  127. Chapter Thirty Eight. Encapsulation by Film Deposition
  128. Bibliography
  129. References
  130. Chapter Thirty Nine. Via Technologies for MEMS
  131. Bibliography
  132. References
  133. Chapter Forty. Outgassing and Gettering
  134. Bibliography
  135. References
  136. Chapter Forty One. Dicing of MEMS Devices
  137. Bibliography
  138. References
  139. Chapter Forty Two. Hermeticity Tests
  140. Bibliography
  141. References
  142. Appendix 1. Common Abbreviations and Acronyms
  143. Appendix 2. Nanoindentation Characterization of Silicon and other MEMS Materials
  144. Bibliography
  145. References