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Handbook of Mems for Wireless and Mobile Applications by D Uttamchandani

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9

Wafer-level packaging technology for RF MEMS

S. Seok,     Iemn Cnrs, France

Abstract:

This chapter discusses the wafer-scale packaging technology for radio frequency microelectromechanical systems (RF MEMS) devices. First, the need for the wafer-level packaging of RF MEMS devices and the electrical effect of the packaging cap are assessed. This chapter shows examples of different types of packaging techniques, with emphasis on wafer-level bonding using hard cap materials, such as silicon and glass, and polymer cap materials, based on benzo-cyclobutene and PerMX.

Key words

wafer-level packaging

polymer

BCB

PerMX

RF MEMS

9.1 Introduction

As microelectromechanical systems (MEMS) packaging is being recognized as an essential technique for ...

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