S. Seok, Iemn Cnrs, France
This chapter discusses the wafer-scale packaging technology for radio frequency microelectromechanical systems (RF MEMS) devices. First, the need for the wafer-level packaging of RF MEMS devices and the electrical effect of the packaging cap are assessed. This chapter shows examples of different types of packaging techniques, with emphasis on wafer-level bonding using hard cap materials, such as silicon and glass, and polymer cap materials, based on benzo-cyclobutene and PerMX.
As microelectromechanical systems (MEMS) packaging is being recognized as an essential technique for ...