Index
Activation Energy
ammonia evaporation
decomposition of H2O2 in SC-
decomposition of H2O2 in SC-
etching of Si
etching of Si3N4
etching of SiO2
surface activation
Adsorption
hydrogen
metal
moisture
surfactant
Aluminum
etching
metal
passivation
reactivity
residues
stripping of photoresist
Amine-based Chemistry
Ammonium Bifluoride
Ammonium Hydroxide
Ammonium Hydroxide Hydrogen Peroxide Mixture (APM)
Angle Resolved X-ray Photoelectron Spectroscopy (ARXPS)
Anneal, Annealing
Atomic Force Microscopy (AFM)
Auger Analysis
Azole Corrosion Inhibitors
azole compounds
benzotriazole (BTA)
triazole (TAZ)
Bath Life
Bath Stability
Bevel Edge Contamination Analysis
Bond Strength
Bonding
bonding energy
conductive bonding
direct bonding
wafer bonding
Boron Diffusion into Gate Oxide
Brush Scrubbing
Buffered Oxide Etch (BOE) and Buffered Hydrofluoric Acid (BHF)
Buffering Agents
Carboxylic Acid Corrosion Inhibitors
Caro’s acid
Cascade Rinser
Charge Damage
Chelating Agents
Chemical
blending
delivery systems
distribution
management
recycling
reprocessing
reuse
waste
Chemical Contamination
inorganic
metallic ion
organic
particulate
Chemical Formulation
Chemical Mechanical Planarization (CMP)
Chemical Oxide
chemical oxide formation
ozonated water oxide formation
SC-1 oxide formation
Chemical Purity
Cleaning
RCA cleaning
standard clean 1 (SC-1)
standard clean 2 (SC-2)
Concentration Control
Conductivity
ionic
metallic
Conductivity Measurement
Contact Angle
Contamination Control
Copper Cleaning Formulations ...
