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Electromigration in Thin Films and Electronic Devices by C-U Kim

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6

The evolution of microstructure in copper interconnects during electromigration

A.S. Budiman,     SunPower Corporation, USA

Abstract:

The key concepts and experimental techniques in investigating the evolution of microstructure in Cu interconnects during electromigration are discussed and some of the fundamental changes in the microstructure during electromigration are described. The practical implications of such microstructural changes in relation to electromigration degradation mechanisms and lifetime measurement methodology are assessed.

Key words

electromigration

microstructure

plastic deformation

synchrotron X-ray microdiffraction

copper interconnects

6.1 Introduction

Studies of the evolution of microstructure during electromigration ...

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