Post-CMP Cleaning
Manish Keswani*; Zhenxing Han† * Materials Science and Engineering, University of Arizona, Tucson, Arizona, USA† Micron Technology Inc., Boise, Idaho, USA
Abstract
Chemical mechanical planarization (CMP) has emerged as a critical step in integrated circuit fabrication for achieving global surface planarization of various thin films in the front- and back-end processing. This has led to the development of novel and advanced post-CMP cleaning techniques that can effectively remove different types of contaminants (e.g., particulate, organic, metallic, etc.) from surfaces. There is an increasing effort toward improving the fundamental understanding of the interfacial phenomena and the underlying physical and mechanical ...
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