Appendix B. Partial List of Packages and Footprints and Some of the Footprints Included in OrCAD Layout
| Abbreviation | Full name |
|---|---|
| BDIP (SDIP) | Butt-mounted dual inline package (surface DIP, std pitch) |
| BGA | Ball grid array |
| BQFP | Bumper quad flat package |
| CBGA | Ceramic column ball grid array |
| CFP | Ceramic flat packages |
| CGA | Column grid array |
| CQFP | Ceramic quad flat packages |
| DIMM | Dual inline memory module |
| DIP | Dual inline package |
| DO | Diode outline |
| DPAK | Discrete packaging (type 1, TO-252) |
| D2PAK | Discrete packaging (type 2, TO-263) |
| D3PAK | Discrete packaging (type 3, TO-268) |
| LCC/LCCS | Leadless chip carrier/leadless ceramic chip carrier |
| LGA | Land grid array |
| MELF | Metal electrode face |
| MSOP | Micro (mini) small outline package |
| MLP | Micro leadframe package (no lead) |
| PGA ... |
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