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Advanced Circuits for Emerging Technologies

Book Description

The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies.

The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.

Table of Contents

  1. Cover
  2. Title Page
  3. Copyright
  4. Preface
  5. Contributors
  6. Part I: Digital Design and Power Management
    1. Chapter 1: Design in the Energy–Delay Space
      1. 1.1 Introduction
      2. 1.2 Energy and Delay Modeling
      3. 1.3 Energy–Delay Space Analysis and Hardware-Intensity
      4. 1.4 Energy-Efficient Design of Digital Circuits
      5. 1.5 Design of Energy-Efficient Pipelined Systems
      6. 1.6 Conclusion
      7. References
    2. Chapter 2: Subthreshold Source-Coupled Logic
      1. 2.1 Introduction
      2. 2.2 UltraLow Power CMOS Logic: Design and Tradeoffs
      3. 2.3 Subthreshold Source-Coupled Logic
      4. 2.4 Power-Frequency Scaling
      5. 2.5 Conclusions
      6. Acknowledgment
      7. References
    3. Chapter 3: Ultralow-Voltage Design of Nanometer CMOS Circuits for Smart Energy-Autonomous Systems
      1. 3.1 Introduction
      2. 3.2 Impact of Technology Scaling on Subthreshold MOSFET Characteristics
      3. 3.3 Scaling Trend of the Minimum-Energy Point
      4. 3.4 Practical Energy of Nanometer ULV Circuits under Robustness and Timing Constraints
      5. 3.5 Technology/Circuit Methodology and Roadmap for ULV Design in the Nanometer Era
      6. 3.6 Conclusion
      7. Acknowledgment
      8. References
    4. Chapter 4: Impairment-Aware Analog Circuit Design by Reconfiguring Feedback Systems
      1. 4.1 Introduction
      2. 4.2 Theorem of Impairment-Aware Analog Design in Feedback Systems
      3. 4.3 Practical Implementations
      4. 4.4 Measured Results
      5. 4.5 Conclusions
      6. References
    5. Chapter 5: Rom-Based Logic Design: A Low-Power Design Perspective
      1. 5.1 Introduction
      2. RBL Design
      3. 5.3 RBL Adder
      4. 5.4 RBL Multiplier
      5. 5.5 Conclusions
      6. Acknowledgment
      7. References
    6. Chapter 6: Power Management: Enabling Technology
      1. 6.1 Macroeconomic Drivers for Power Technologies
      2. 6.2 Market Trends
      3. 6.3 Application Examples
      4. 6.4 Technology Implications and Trends
      5. 6.5 Current Technologies and Capabilities
      6. 6.6 Specific Application Example
      7. 6.7 Emerging Technologies
      8. 6.8 Conclusion
      9. References
    7. Chapter 7: Ultralow Power Management Circuit for Optimal Energy Harvesting in Wireless Body Area Network
      1. 7.1 Introduction
      2. 7.2 Wireless Body Area Network
      3. 7.3 Optimal Energy Harvesting System
      4. 7.4 Ultralow Power Management Integrated Circuit for Solar Energy Harvesting System
      5. 7.5 Conclusions
      6. References
  7. Part II: Analog and RF Design
    1. Chapter 8: Analog Circuit Design for SOI
      1. 8.1 SOI Devices
      2. 8.2 Partially Depleted SOI
      3. 8.3 FDSOI and fINFET
      4. 8.4 Device Considerations (FDSOI AND PDSOI)
      5. 8.5 Analog Circuit Building Blocks
      6. 8.6 Operational Amplifiers
      7. 8.7 Operational Transconductance Amplifier
      8. 8.8 Radio Frequency Low-Noise Amplifier
      9. 8.9 Mixers and Analog Multipliers
      10. 8.10 Analog to Digital and Digital to Analog Converters
      11. 8.11 Summary
      12. References
    2. Chapter 9: Frequency Generation and Control With Self-Referenced CMOS Oscillators
      1. 9.1 Introduction
      2. 9.2 Self-Referenced CMOS Oscillators
      3. 9.3 Packaging
      4. 9.4 Conclusion
      5. Acknowledgments
      6. References
    3. Chapter 10: Synthesis of Static and Dynamic Translinear Circuits
      1. 10.1 Translinear Circuits: What Is In a Name?
      2. 10.2 The Scope of Translinear Circuits
      3. 10.3 Static and Dynamic Translinear Circuit Synthesis
      4. 10.4 Static Translinear Circuit Synthesis Examples
      5. 10.5 Dynamic Translinear Circuit Synthesis Examples
      6. References
    4. Chapter 11: Microwatt Power Cmos Analog Circuit Designs: Ultralow Power Lsis for Power-Aware Applications
      1. 11.1 Introduction
      2. 11.2 Subthreshold Characteristics in a MOSFET
      3. 11.3 Low-Power Voltage Reference Circuits
      4. 11.4 Low-Power Current Reference Circuits
      5. 11.5 Example of Power-Aware LSI Applications: CMOS Smart Sensor for Monitoring the Quality of Perishables
      6. 11.6 Conclusion and Discussion
      7. References
    5. Chapter 12: High-Speed Current-Mode Data Drivers for Amoled Displays
      1. 12.1 Introduction
      2. 12.2 Current-Mode Drivers in Representation of the Second-Generation Current Conveyor
      3. 12.3 Improved Transient Current Feed-Forward Output Buffer
      4. 12.4 Push-Pull Transient Current Feedforward Output Buffer
      5. 12.5 Conclusion
      6. References
    6. Chapter 13: RF Transceivers for Wireless Applications
      1. 13.1 Transmitter Architectures
      2. 13.2 Cartesian Transmitters
      3. 13.3 Constant-Envelope Transmitters Using Phase Modulated Loops
      4. 13.4 Polar Transmitters
      5. 13.5 Case Studies
      6. References
  8. Part III: Device Layout and Reliability
    1. Chapter 14: Technology-Aware Communication Architecture Design for Parallel Hardware Platforms
      1. 14.1 Introduction
      2. 14.2 NOC Building Blocks: The Switch
      3. 14.3 NOC Connectivity Pattern
      4. 14.4 NOCS and the GALS Paradigm
      5. 14.5 Putting Everything Together: Technology-Aware Network Connectivity
      6. 14.6 Looking Forward: Mesochronous Synchronization
      7. 14.7 Conclusions
      8. References
    2. Chapter 15: Design and Optimization of Integrated Transmission Lines on Scaled CMOS Technologies
      1. 15.1 Introduction
      2. 15.2 Coplanar Waveguides
      3. 15.3 Shielded Transmission Lines
      4. 15.4 Accurate and Fast Analysis of Periodic Lines
      5. 15.5 Design and Experimental Results
      6. 15.6 Conclusions
      7. References
    3. Chapter 16: On-Chip Surfing Interconnect
      1. 16.1 Introduction
      2. 16.2 Surfing
      3. 16.3 Surfing DLLs
      4. 16.4 Pipelined Clock Forwarding
      5. 16.5 Source Synchronous Surfing
      6. 16.6 Surfing Handshakes
      7. 16.7 Summary
      8. References
    4. Chapter 17: On-Chip Spiral Inductors With Integrated Magnetic Materials
      1. 17.1 Introduction
      2. 17.2 Previous Work
      3. 17.3 Magnetic Materials
      4. 17.4 Simulation Study
      5. 17.5 Device Fabrication
      6. 17.6 Measurement Results
      7. 17.7 Potential Applications of On-Chip Spiral Inductors with Magnetic Materials
      8. 17.8 Conclusion
      9. References
    5. Chapter 18: Reliability of Nanoelectronic VLSI
      1. 18.1 Introduction
      2. 18.2 Increased Defect Density and Reliability
      3. 18.3 Reliability Evaluation
      4. 18.4 Historically Important CAD Tools
      5. 18.5 Recent Progress
      6. 18.6 Monte Carlo Reliability Evaluation Tool
      7. 18.7 Fault-Tolerant Computing
      8. 18.8 Conclusions
      9. Acknowledgments
      10. References
    6. Chapter 19: Temperature Monitoring Issues in Nanometer CMOS Integrated Circuits
      1. 19.1 Introduction
      2. 19.2 From Where Does Heat Come in Nanometer Circuits?
      3. 19.3 Harmful Effects Due to Temperature in VLSI Chips
      4. 19.4 Temperature Sensing for DTM
      5. 19.5 Thermal Modeling
      6. 19.6 Thermal Sensor Placement and Allocation
      7. 19.7 Temperature Monitoring Networks
      8. 19.8 Conclusions
      9. Acknowledgments
      10. References
  9. Part IV: Circuit Testing
    1. Chapter 20: Low-Power Testing for Low-Power LSI Circuits
      1. 20.1 Introduction
      2. 20.2 Test Power Problem in Logic LSI Testing
      3. 20.3 Basic Strategies to Test Power Reduction
      4. 20.4 Shift Power Reduction
      5. 20.5 Capture Power Reduction
      6. 20.6 Toward Next-Generation Low-Power Testing Solutions
      7. 20.7 Summary
      8. References
    2. Chapter 21: Checkers for Online Self-Testing of Analog Circuits
      1. 21.1 Introduction
      2. 21.2 Time-Invariant Linear Circuits
      3. 21.3 Fully Differential Circuits
      4. 21.4 Conclusions
      5. References
    3. Chapter 22: Design and Test of Robust CMOS RF and MM-Wave Radios
      1. 22.1 Introduction
      2. 22.2 Why Robust RF and mm-Wave ICs?
      3. 22.3 Design Methodology for First-Time-Right Radio SOCs
      4. 22.4 Robust RF and mm-Wave Radio Transceivers
      5. 22.5 Summary
      6. References
    4. Chapter 23: Contactless Testing and Diagnosis Techniques
      1. 23.1 Introduction
      2. 23.2 Electron-Beam Method
      3. 23.3 Photoemissive Probing
      4. 23.4 Electro-Optic Probing
      5. 23.5 Charge Density Probing
      6. 23.6 Photoexcitation Probe Techniques
      7. 23.7 Electric Force Microscopy
      8. 23.8 Capacitive Coupling Method
      9. 23.9 Dynamic Internal Testing of CMOS using Hot-Carrier Luminescence
      10. 23.10 All-Silicon Optical Contactless Testing of Integrated Circuits
      11. 23.11 Conclusion
      12. References
  10. Index