Index

A

a-terp-epoxide, 143
ABAQUS FEM software, 37
acrylate, 217–18
acrylic, 2
adhesive curing, 222–3
adhesive dispensing, 221–2
adhesive strength, 216–17
adhesives joining technology, 1–11
classification of adhesives used in electronic packaging, 2–6
chemical formulation, 2–3
curing process, 4
functions, 5–6
linear (thermoplastic) and cross-linked (thermosetting) polymer, 3
molecular structure, 3–4
physical form, 2
electronic assemblies overview, 6–10
board level integration of packages, 8
DIP and PGA, 9
electronic packaging hierarchy, 7
SOP, QFP and BGA package, 10
photonics, 214–55
applications, 218
characteristics, 215–17
fabrication of photonic devices, 235–55 ...

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