J.W.C. De Vries and J.F.J.M. Caers, Philips Applied Technologies, The Netherlands
This chapter presents an industrial approach to anisotropic conductive adhesive interconnection technology. The focus is on the long- term performance for this type of electrical interconnection as an alternative to soldered joints of very fine pitch (less than 100 μm). Beginning with a brief description of what an adhesive bond actually is, as compared with a soldered joint, the most important material properties and the critical stress factors are considered. They are illustrated by discussing some case studies: heat seal connectors and ultra-thin ball grid array packages.