O'Reilly logo

Advanced Adhesives in Electronics by M Alam, C Bailey

Stay ahead with the world's most comprehensive technology and business learning platform.

With Safari, you learn the way you learn best. Get unlimited access to videos, live online training, learning paths, books, tutorials, and more.

Start Free Trial

No credit card required

2

Thermally conductive adhesives in electronics

J. Felba,     Wroclaw University of Technology, Poland

Abstract:

The heat dissipation problem is becoming a crucial barrier in the process of electronic devices and systems’ miniaturization. This chapter discusses heat transport in adhesives used for electronic packaging consisting of a polymer base material matrix and a thermally conducting filler. Practically, only the material of the filler influences the adhesive thermal conductivity, which is limited mainly by the thermal contact resistance between filler particles. The result is that the thermal conductivity of composites saturated with micro- or nanometer-sized particles of very well thermally conducting materials – such as silver, diamond, ...

With Safari, you learn the way you learn best. Get unlimited access to videos, live online training, learning paths, books, interactive tutorials, and more.

Start Free Trial

No credit card required