Thermally conductive adhesives in electronics
J. Felba, Wroclaw University of Technology, Poland
Abstract:
The heat dissipation problem is becoming a crucial barrier in the process of electronic devices and systems’ miniaturization. This chapter discusses heat transport in adhesives used for electronic packaging consisting of a polymer base material matrix and a thermally conducting filler. Practically, only the material of the filler influences the adhesive thermal conductivity, which is limited mainly by the thermal contact resistance between filler particles. The result is that the thermal conductivity of composites saturated with micro- or nanometer-sized particles of very well thermally conducting materials – such as silver, diamond, ...
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