Book description
The #1 Practical Guide to Signal Integrity Design—with Revised Content and New Questions and Problems!
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.
• A fully up-to-date introduction to signal integrity and physical design
• New questions and problems designed for both students and professional engineers
• How design and technology selection can make or break power distribution network performance
• Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
• Practical techniques for analyzing resistance, capacitance, inductance, and impedance
• Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances
• Identifying reflections and crosstalk with free animation tools
• Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
• Understanding how interconnect physical design impacts signal integrity
• Managing differential pairs and losses
• Harnessing the full power of S-parameters in high-speed serial link applications
• Designing high-speed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams
• Ensuring power integrity throughout the entire power distribution path
• Realistic design guidelines for improving signal integrity, and much more
For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.
Table of contents
- Cover Page
- Title Page
- Copyright Page
- Dedication Page
- Contents at a Glance
- Contents
- Preface to the Third Edition
- Preface to the Second Edition
- Preface to the First Edition
- Acknowledgments
- About the Author
-
Chapter 1. Signal Integrity Is in Your Future
- 1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?
- 1.2 Signal-Integrity Effects on One Net
- 1.3 Cross Talk
- 1.4 Rail-Collapse Noise
- 1.5 Electromagnetic Interference (EMI)
- 1.6 Two Important Signal-Integrity Generalizations
- 1.7 Trends in Electronic Products
- 1.8 The Need for a New Design Methodology
- 1.9 A New Product Design Methodology
- 1.10 Simulations
- 1.11 Modeling and Models
- 1.12 Creating Circuit Models from Calculation
- 1.13 Three Types of Measurements
- 1.14 The Role of Measurements
- 1.15 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 2. Time and Frequency Domains
- 2.1 The Time Domain
- 2.2 Sine Waves in the Frequency Domain
- 2.3 Shorter Time to a Solution in the Frequency Domain
- 2.4 Sine-Wave Features
- 2.5 The Fourier Transform
- 2.6 The Spectrum of a Repetitive Signal
- 2.7 The Spectrum of an Ideal Square Wave
- 2.8 From the Frequency Domain to the Time Domain
- 2.9 Effect of Bandwidth on Rise Time
- 2.10 Bandwidth and Rise Time
- 2.11 What Does Significant Mean?
- 2.12 Bandwidth of Real Signals
- 2.13 Bandwidth and Clock Frequency
- 2.14 Bandwidth of a Measurement
- 2.15 Bandwidth of a Model
- 2.16 Bandwidth of an Interconnect
- 2.17 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 3. Impedance and Electrical Models
- 3.1 Describing Signal-Integrity Solutions in Terms of Impedance
- 3.2 What Is Impedance?
- 3.3 Real Versus Ideal Circuit Elements
- 3.4 Impedance of an Ideal Resistor in the Time Domain
- 3.5 Impedance of an Ideal Capacitor in the Time Domain
- 3.6 Impedance of an Ideal Inductor in the Time Domain
- 3.7 Impedance in the Frequency Domain
- 3.8 Equivalent Electrical Circuit Models
- 3.9 Circuit Theory and SPICE
- 3.10 Introduction to Measurement-Based Modeling
- 3.11 The Bottom Line
- End-of-Chapter Review Questions
- Chapter 4. The Physical Basis of Resistance
-
Chapter 5. The Physical Basis of Capacitance
- 5.1 Current Flow in Capacitors
- 5.2 The Capacitance of a Sphere
- 5.3 Parallel Plate Approximation
- 5.4 Dielectric Constant
- 5.5 Power and Ground Planes and Decoupling Capacitance
- 5.6 Capacitance per Length
- 5.7 2D Field Solvers
- 5.8 Effective Dielectric Constant
- 5.9 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 6. The Physical Basis of Inductance
- 6.1 What Is Inductance?
- 6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents
- 6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It
- 6.4 Self-Inductance and Mutual Inductance
- 6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
- 6.6 Partial Inductance
- 6.7 Effective, Total, or Net Inductance and Ground Bounce
- 6.8 Loop Self- and Mutual Inductance
- 6.9 The Power Distribution Network (PDN) and Loop Inductance
- 6.10 Loop Inductance per Square of Planes
- 6.11 Loop Inductance of Planes and Via Contacts
- 6.12 Loop Inductance of Planes with a Field of Clearance Holes
- 6.13 Loop Mutual Inductance
- 6.14 Equivalent Inductance of Multiple Inductors
- 6.15 Summary of Inductance
- 6.16 Current Distributions and Skin Depth
- 6.17 High-Permeability Materials
- 6.18 Eddy Currents
- 6.19 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 7. The Physical Basis of Transmission Lines
- 7.1 Forget the Word Ground
- 7.2 The Signal
- 7.3 Uniform Transmission Lines
- 7.4 The Speed of Electrons in Copper
- 7.5 The Speed of a Signal in a Transmission Line
- 7.6 Spatial Extent of the Leading Edge
- 7.7 “Be the Signal”
- 7.8 The Instantaneous Impedance of a Transmission Line
- 7.9 Characteristic Impedance and Controlled Impedance
- 7.10 Famous Characteristic Impedances
- 7.11 The Impedance of a Transmission Line
- 7.12 Driving a Transmission Line
- 7.13 Return Paths
- 7.14 When Return Paths Switch Reference Planes
- 7.15 A First-Order Model of a Transmission Line
- 7.16 Calculating Characteristic Impedance with Approximations
- 7.17 Calculating the Characteristic Impedance with a 2D Field Solver
- 7.18 An n-Section Lumped-Circuit Model
- 7.19 Frequency Variation of the Characteristic Impedance
- 7.20 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 8. Transmission Lines and Reflections
- 8.1 Reflections at Impedance Changes
- 8.2 Why Are There Reflections?
- 8.3 Reflections from Resistive Loads
- 8.4 Source Impedance
- 8.5 Bounce Diagrams
- 8.6 Simulating Reflected Waveforms
- 8.7 Measuring Reflections with a TDR
- 8.8 Transmission Lines and Unintentional Discontinuities
- 8.9 When to Terminate
- 8.10 The Most Common Termination Strategy for Point-to-Point Topology
- 8.11 Reflections from Short Series Transmission Lines
- 8.12 Reflections from Short-Stub Transmission Lines
- 8.13 Reflections from Capacitive End Terminations
- 8.14 Reflections from Capacitive Loads in the Middle of a Trace
- 8.15 Capacitive Delay Adders
- 8.16 Effects of Corners and Vias
- 8.17 Loaded Lines
- 8.18 Reflections from Inductive Discontinuities
- 8.19 Compensation
- 8.20 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 9. Lossy Lines, Rise-Time Degradation, and Material Properties
- 9.1 Why Worry About Lossy Lines?
- 9.2 Losses in Transmission Lines
- 9.3 Sources of Loss: Conductor Resistance and Skin Depth
- 9.4 Sources of Loss: The Dielectric
- 9.5 Dissipation Factor
- 9.6 The Real Meaning of Dissipation Factor
- 9.7 Modeling Lossy Transmission Lines
- 9.8 Characteristic Impedance of a Lossy Transmission Line
- 9.9 Signal Velocity in a Lossy Transmission Line
- 9.10 Attenuation and dB
- 9.11 Attenuation in Lossy Lines
- 9.12 Measured Properties of a Lossy Line in the Frequency Domain
- 9.13 The Bandwidth of an Interconnect
- 9.14 Time-Domain Behavior of Lossy Lines
- 9.15 Improving the Eye Diagram of a Transmission Line
- 9.16 How Much Attenuation Is Too Much?
- 9.17 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 10. Cross Talk in Transmission Lines
- 10.1 Superposition
- 10.2 Origin of Coupling: Capacitance and Inductance
- 10.3 Cross Talk in Transmission Lines: NEXT and FEXT
- 10.4 Describing Cross Talk
- 10.5 The SPICE Capacitance Matrix
- 10.6 The Maxwell Capacitance Matrix and 2D Field Solvers
- 10.7 The Inductance Matrix
- 10.8 Cross Talk in Uniform Transmission Lines and Saturation Length
- 10.9 Capacitively Coupled Currents
- 10.10 Inductively Coupled Currents
- 10.11 Near-End Cross Talk
- 10.12 Far-End Cross Talk
- 10.13 Decreasing Far-End Cross Talk
- 10.14 Simulating Cross Talk
- 10.15 Guard Traces
- 10.16 Cross Talk and Dielectric Constant
- 10.17 Cross Talk and Timing
- 10.18 Switching Noise
- 10.19 Summary of Reducing Cross Talk
- 10.20 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 11. Differential Pairs and Differential Impedance
- 11.1 Differential Signaling
- 11.2 A Differential Pair
- 11.3 Differential Impedance with No Coupling
- 11.4 The Impact from Coupling
- 11.5 Calculating Differential Impedance
- 11.6 The Return-Current Distribution in a Differential Pair
- 11.7 Odd and Even Modes
- 11.8 Differential Impedance and Odd-Mode Impedance
- 11.9 Common Impedance and Even-Mode Impedance
- 11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components
- 11.11 Velocity of Each Mode and Far-End Cross Talk
- 11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
- 11.13 Measuring Even- and Odd-Mode Impedance
- 11.14 Terminating Differential and Common Signals
- 11.15 Conversion of Differential to Common Signals
- 11.16 EMI and Common Signals
- 11.17 Cross Talk in Differential Pairs
- 11.18 Crossing a Gap in the Return Path
- 11.19 To Tightly Couple or Not to Tightly Couple
- 11.20 Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements
- 11.21 The Characteristic Impedance Matrix
- 11.22 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 12. S-Parameters for Signal-Integrity Applications
- 12.1 S-Parameters, the New Universal Metric
- 12.2 What Are S-Parameters?
- 12.3 Basic S-Parameter Formalism
- 12.4 S-Parameter Matrix Elements
- 12.5 Introducing the Return and Insertion Loss
- 12.6 A Transparent Interconnect
- 12.7 Changing the Port Impedance
- 12.8 The Phase of S21 for a Uniform 50-Ohm Transmission Line
- 12.9 The Magnitude of S21 for a Uniform Transmission Line
- 12.10 Coupling to Other Transmission Lines
- 12.11 Insertion Loss for Non-50-Ohm Transmission Lines
- 12.12 Data-Mining S-Parameters
- 12.13 Single-Ended and Differential S-Parameters
- 12.14 Differential Insertion Loss
- 12.15 The Mode Conversion Terms
- 12.16 Converting to Mixed-Mode S-Parameters
- 12.17 Time and Frequency Domains
- 12.18 The Bottom Line
- End-of-Chapter Review Questions
-
Chapter 13. The Power Distribution Network (PDN)
- 13.1 The Problem
- 13.2 The Root Cause
- 13.3 The Most Important Design Guidelines for the PDN
- 13.4 Establishing the Target Impedance Is Hard
- 13.5 Every Product Has a Unique PDN Requirement
- 13.6 Engineering the PDN
- 13.7 The VRM
- 13.8 Simulating Impedance with SPICE
- 13.9 On-Die Capacitance
- 13.10 The Package Barrier
- 13.11 The PDN with No Decoupling Capacitors
- 13.12 The MLCC Capacitor
- 13.13 The Equivalent Series Inductance
- 13.14 Approximating Loop Inductance
- 13.15 Optimizing the Mounting of Capacitors
- 13.16 Combining Capacitors in Parallel
- 13.17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors
- 13.18 Selecting Capacitor Values
- 13.19 Estimating the Number of Capacitors Needed
- 13.20 How Much Does a nH Cost?
- 13.21 Quantity or Specific Values?
- 13.22 Sculpting the Impedance Profiles: The Frequency-Domain Target Impedance Method (FDTIM)
- 13.23 When Every pH Counts
- 13.24 Location, Location, Location
- 13.25 When Spreading Inductance Is the Limitation
- 13.26 The Chip View
- 13.27 Bringing It All Together
- 13.28 The Bottom Line
- End-of-Chapter Review Questions
- Appendix A. 100+ General Design Guidelines to Minimize Signal-Integrity Problems
- Appendix B. 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects
- Appendix C. Selected References
- Appendix D. Review Questions and Answers
- Index
Product information
- Title: Signal and Power Integrity - Simplified, 3rd Edition
- Author(s):
- Release date: January 2018
- Publisher(s): Pearson
- ISBN: 9780134512228
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