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23rd European Symposium on Computer Aided Process Engineering by Ilkka Turunen, Andrzej Kraslawski

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CPU Heat Sink Cooled by Nanofluids and Water: Experimental and Numerical Study

Mateusz Korpyśa, Mohsen Al-Rashedb, Grzegorz Dzidoa and Janusz Wójcika,    aSilesian University of Technology, Department of Chemical and Process Engineering, ks. M. Strzody 7, 44-100 Gliwice, Poland, bPublic Authority for Applied Education and Training, College of Technological Studies, Department of Chemical Engineering, 70654, Kuwait

Abstract

In this study, a commercial heat sink was employed for cooling a PC processor. Two liquids were used (i) water and (ii) copper oxide (II) nanofluids with 0.0086 and 0.0225 volume fractions. In the experiments, the heat sink was fixed to the CPU. The maximal power dissipated by the investigated processor was 115 W. The mass ...

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